Stainless Steel - These stencils are made of high quality stainless steel, the thickness of steel mesh is perfect. Not Easy To Deform - They can be heated by the hot air machine, these stencils are not easy to deform when heated. Cooperate with ordinary air , the manual reballing can be carried out, no need to purchase another reballing platform. Each 27 pieces - Basically covers the current common BGA chip, enough to meet your various needs. Specially Designed - It is specially designed for laptop, desktop, communication main board north-south bridge, and graphics card, etc all kinds of BGA chips. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering. Soldering Accessories - The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. However, for the chip that the alignment of solder ball is uneven, or with a different spacing chips, this stencil is . Important Tips - Leaded solder ball melting point 183 degrees, alloy SN63PB37 (tin 63% lead 37%). Unleaded solder ball melting point 217 degrees Celsius. Alloy SN96.5 ag3cu0.5 (tin 96.5% silver 3% copper 0.5%). When heated directly with the air . Pay attention to adjusting air temperature. It doesn't need too high temperature. Otherwise, will in the deformation of the stencils. Material:Stainless steel colour:Silver Package Contents: 27 x stencils Only the above package content, other products are not included. Note: Light reflection and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.