1. Manufacturing challenges in electronic packaging: an overview. - 1. 1 Introduction. - 1. 2 Industries and markets and applications segments. - 1. 3 Semiconductor technology trends and roadmap forecast. - 1. 4 Microelectronic packaging. - 1. 5 PCB manufacturing for organic packaging. - 1. 6 Assembly technology in manufacturing of electronic packages. - 1. 7 Conclusion. - References. - 2. Challenges in solder assembly technologies. - 2. 1 Introduction. - 2. 2 The interaction of soldering process with soldering materials. - 2. 3 Processing the challenges. - 2. 4 Soldering materials issues. - 2. 5 Summary and conclusions. - References. - 3. Testing and characterization. - 3. 1 Introduction. - 3. 2 Coefficient of thermal expansion. - 3. 3 Mechanical characterization of thin-film materials. - 3. 4 Tensile ductility of plated copper. - 3. 5 PTH cracking. - 3. 6 Warpage. - 3. 7 Solder strain. - 3. 8 Fracture toughness and crack propagation. - 3. 9 Adhesion and interfacial delamination. - 3. 10 Moisture. - 3. 11 Summary. - References. - 4. Design for manufacture and assembly of electronic packages. - 4. 1 Introduction. - 4. 2 General considerations. - 4. 3 Design guidelines for the manufacture of PCBs. - 4. 4 Design guidelines for the assembly of PCBs. - 4. 5 Estimating the assembly cost. - 4. 6 Case study. - 4. 7 Concluding remarks. - References. - 5. Process modeling optimization and control in electronics manufacturing. - 5. 1 Introduction. - 5. 2 Physical models. - 5. 3 Empirical models. - 5. 4 Combined physical-empirical models. - 5. 5 Process optimization. - 5. 6 Run-by-run and real-time process control. - 5. 7 Concluding remarks. - References. - 6. Integrated manufacturing system for printed circuit board assembly. - 6. 1 Introduction. - 6. 2 Requirements of PCB assembly system. - 6. 3 Outline of integrated manufacturing system for PCB assembly. - 6. 4 Assembly process planning. - 6. 5 Assembly scheduling. - References. Language: English