Feature: 1. TEC1‑12706 semiconductor cooling plate is used, and the quality is good. 2. A complete sealing structure that isolates moisture from the air. 3. With higher reliability and better working performance. 4. Light weight, small size and easy to install. 5. Excellent DIY kit for electronic enthusiasts in semiconductor cooling applications. Specification: Item Type:Semiconductor Cold Plate Semiconductor Cold Plate: TEC1-12706 Size:40 x 40 x 3.75mm / 1.57 x 1.57 x 0.15in Internal Resistance: 2.1~2.4Ω Highest Temperature Difference: Above 67°C Working Current: Imax. = 4~4.6A (Rated 12V) Cooling Power: Up To 70 Watts Working Environment: -55~83℃ Sealing Process: Standard 704 Silicone Rubber Seal All Sides Fan: DC 12V Conductive module size:60 x 45 x 30mm / 2.36 x 1.77 x 1.18in Water block size:40 x 40 x 12mm / 1.57 x 1.57 x 0.47in Fan size:40 x 40 x 10mm / 1.57 x 1.57 x 0.39in . Package List: 1 x Thermal Module (Heat Sink)1 x Water Block (Water)1 x TEC1-12706 (Semiconductor Cold Plate)1 x Thermal Grease1 x Fan1 x Aluminum Substrate1 x Screw Mounting Kit Note: 1. When the temperature is below -25 ° C, the conduction cooling module will frost.2. TEC1-12706: One side is the cooling side and the other side is the heat sink side.3. A heat sink or water-cooled heat sink must be installed on the heat-dissipating side; otherwise the cool sink will be burned.4. This kit does not include DC power, please prepare it yourself.