1Made of high quality stainless steel and the thickness of the steel mesh is very good. 2 Can be heated by a hot air blower directly for better performance and high reliability. 3 These templates are not easily deformed when heated, and can be reballing by hot air blower for convenience. 4 The table mold area matches to the area of the for BGA chip, which can reduce the waste of solder balls. 5 For BGA heavy ball general mold direct heating rework general chip repair of desktop laptop, game consoles, etc. Condition: 100 percent Brand New Item Type: For BGA Universal Stencils Material: Stainless Steel Color: As Pictures Shown Quantity: 27Pcs or Set Application: For BGA Chips Reballing Stencils Size: 0.65mm Spacing 1.0mm 0.5mm Spacing 0.8mm 0.45mm Spacing 0.78mm 0.4mm Spacing 0.78mm 0.6mm Spacing 1.0mm 0.6mm Spacing 0.9mm 0.6mm Spacing 1.1mm 0.76mm Spacing 1.27mm 0.55mm Spacing 1.02mm 0.5mm 35 x 35 Spacing 0.78 mm 0.5mm 40 x 40 Spacing 0.8mm 0.76mm 30 x 30 0.6mm 24 x 24 0.6mm 27 x 27 0.3mm Spacing 0.58mm 0.35mm Spacing 0.65mm 0.35mm Spacing 0.6mm 0.3mm Spacing 0.5mm 0.25mm Spacing 0.5mm 0.76mm 34 x 34 0.76mm 37 x 37 Spacing 1.27mm 0.76mm 41 x 41 Spacing 1.27mm 1.0mm Spacing 1.5mm 0.6mm 30 x 30 0.6mm 33 x 33 0.76mm 33 x 33 Spacing 1.27mm 0.6mm 41x41 27 Pcs or Set x For BGA Universal Stencils