Features:300 high temperature resistant in the short run, 250 high temperature resistant for a long time. High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time. High insulation ensures the safety. Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling. 33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding. Specification:Product type: Heat Insulation Adhesive TapeThickness: approx. 0.06mmLength: approx. 33mStretchability: 35%Peel strength: 5N/25mmTensile force: 135N/25mmTemperature resistant: Long time: 250; Short time: 300Width: 20mm, 30mm, 50mm for your choicePackage size: approx. 9.5 * 9.5 * 2 cm/ 3.74 * 3.74 * 0.79 inPackage weight: 47gPackage List:1 * Heat Insulation Adhesive Tape1300 high temperature resistant in the short run, 250 high temperature resistant for a long time.2High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time.3High insulation ensures the safety.4Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling.533m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding.