- Experience exceptional comfort with an ergonomically designed handle that enhances your grip, making extended use effortless. - Equipped with a double-headed SK5 blade, this tool is specifically engineered for effectively separating solder joints, ensuring precision in your projects. - Ideal for BGA repair, this tool is perfect for safely disassembling mobile phone CPU chips and performing other essential mobile device repairs. - Crafted from flexible steel, the blade maintains its shape even under pressure, providing durability and strength that stands up to regular use. - Versatile and reliable, this tool supports a wide range of applications including motherboard repairs, hardware maintenance, and instrument repairs. Practical Use Scenarios: - Use it to efficiently separate solder joints when repairing circuit boards, minimizing damage to surrounding components. - Perfect for technicians disassembling mobile devices, ensuring safe removal of delicate chips without risk of breakage. - Great for hobbyists and professionals alike, this tool is an essential addition to any repair kit, enhancing your ability to tackle a variety of electronic repairs with confidence.