Features: Combining gold plating with rapid heat transfer to minimize tool switching during intricate motherboard repairs. Featuring a spherical head design with uniform temperature distribution, optimizes drag soldering tasks while maintaining stable heat retention for prolonged circuit board maintenance. Designed for professional mobile phone repair technicians and electronics engineers requiring millimeter accuracy in soldering pad repairs, connector replacement. Ideal for workshop environments handling delicate smartphone motherboard restorations, or soldering tasks where space efficient tool ensuring organized workstation management. This soldering iron tip achieves 40% faster thermal recovery than standard models, making it indispensable for high frequency PCB soldering toolkits in commercial repair scenarios. Specifications: Component:Iron Size:Approx.203mm/7.99inch Package Includes: 1Pc Ball Soldering Tip note: 1.Please allow 1-2cm errors due to manual measurement, making sure that you not mind before order. 2.Due to the differences between different monitors, the picture may not reflect the actual of the item.