STAMPS3 is a highly integrated embedded main control core module, using Lexin ESP32-S3FN8main control chip, 8MSPI flash memory, equipped with high-performance Xtensa 32-bit LX7 dual-core processor, main frequency up to 240MHz. Built-in highly integrated 5V to 3.3V circuit, RGB status indicator, programmable button, module leads out ESP32-S3 all GPIO, and in the form of 1.27MM/2.54MM spacing lead, support SMT, DIP row, DIP row and Jump wireand other ways of use; The product features compact volume, strong performance, rich expansion IO and low power consumption. The module is suitable for IoT application scenarios with embedded main control modules. ESP32-S3FN8(2.4GHz Wi-Fi) Minimal system board Multi-IO lead-out, support multiple application forms (SMT, DIP, flying wire) Integrated programmable RGB LEDs and buttons Support UIFlow graphical programming Applications: Smart home Wearables equipment Colour:Black Material:Plastic + electronic components Different batches may have different appearance, which does not affect use. Package Contents: 1 x StampS3 Module 1 x HY2.0-4P terminal 1 x 2.54-9P header 1 x 2.54-6P header 1 x Hex Key